1) In the measurement procedures of die bonding process, we apply infrared system to measure the thermal resistance and use bonding tester to estimate the die shear strength.

2) The die bonding requires the temperature field of the oven to be even, but an existing curing oven can not suit the requirement.

3) Thermal mismatch induced by the die bonding structure greatly affects the reliability and performance of MEMS devices.

4) Die bonding is one of the important processes to manufacture the IC components, which must make in the die bonder.

5) This product design for IC assembly die bonding process on die bonder machine.

6) Die bonding plays a key role in effecting the quality and efficiency of IC production. The rapid development brings a challenge to the system in utmost stroke, speed,(http:///die bonding.html) acceleration and accuracy.

7) Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.

8) The thermal resister of power LED is analyzed in this paper. Using the silver paste and epoxy resin as die bonding materials, two kinds of power LEDs are made.

9) Compared with the prior art, the mechanical structure greatly enhances the efficiency of the die taking and the die bonding, and can obtain very high precision by setting appropriate parameters.

10) Wafer chip scale packaging(WCSP) eliminates conventional packaging steps such as die bonding, wire bonding, and die level flip chip attach processes.