1. By analyzing the thethe surface waviness are given are available the futher step to dynamic optimization.

2. Waviness - Widely spaced imperfections on the surface of a wafer.

3. This defect may be caused by the waviness of paper which contacted the plate twice.

4. Through the rail flatness inspection, the causes for waviness are found.

5. The surface profile of joints can be characterized by the waviness and unevenness components.

6. This paper presents a vibration model of bearing with outer race waviness and deduces the response of bearing by applying the method of analysis mechanics.

7. A new integrated measuring system for curved surface roughness waviness and form error is introduced.