1) In this paper a maskless bumping technique to create thin solder caps will be show.

2) The beam division method in maskless laser interference photolithography can be divided into wave-front division and amplitude division.

3) The advantage for the maskless lithography technology be reduce the mask costs.

4) This paper describes the maskless wiring formation technology not using photomask and photoresist, development of metal nano particle and nano ink, application of the inkjet method and future theme.

5) Simulation and experiments show that for point array or hole array patterns with the same sizes maskless interference photolithography is much simple than the traditional photolithography.

6) In this paper, the present, the existing problem and the prospect for the maskless lithography technology are introduced.